this post was submitted on 15 Dec 2023
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Just FYI, the tick-tock model followed by Intel doesn’t directly have anything to do with sockets and pin outs.
The tick-tock model meant that after each change of the microarchitecture was followed by a die shrink. While a new socket is likely a consequence of these changes, it is a necessary byproduct rather than an intentional change.
Furthermore, Intel hasn’t used the tick-tock model since 2016.
However, trying to compare terrestrial consumer hardware with rugged radiation hardened hardware is futile. They have drastically different design/engineering specs that have hard limits with respect to physics, even special process nodes for true radiation hardening (RHBP). I think they’re only 150nm, I want to say there were some RHBP 65nm FPGAs recently, but I’m not 100%.
I have a feeling though if NASA were to make components, they’d all just be specialized embedded systems rather than anything consumer or enterprise. After all, computers are but tools to do different jobs.
Can ya not take a joke? I even stated as much lmao
Hahaha, yeahhhhhh, sorry mate. I get going about space electronics and there goes the rest of the day!
All good, I get a kick on showing my knowledge too haha or lack of in most cases.
I still want a mobo that can outlast my fkn CPU! HELP NASA! ;)
PS thanks for correcting me about the end of Intel's tic tock model with their inability to shrink a node for 5 or so years